EWI Signs Agreement With S-Bond Technologies

EWI (Edison Welding Institute; Columbus, OH) announced an agreement with S-Bond Technologies LLC (Lansdale, PA), giving the company the ability to distribute its environmentally-friendly lead-free, fluxless solder marketed by EWI as EWI SonicSolder®. The agreement is effective immediately.

Dr. Ronald Smith, president of S-Bond Technologies stated, "We are pleased to partner with EWI in growing the application of fluxless solder joining technologies. We see our partnership with EWI and our licensing of its SonicSolder technology as an enhancement to our own patented active solder product line by broadening our capabilities to provide more cost effective assembly solutions."

Henry Cialone, president and CEO of EWI said, "We're excited to partner with S-Bond Technologies, further leveraging our patent in the marketplace. The partnership gives S-Bond a nice addition to its already strong portfolio of solder that will hopefully open up new markets for them with its cost-effective pricing."

EWI SonicSolder is an EWI-patented binary lead-free solder alloy that melts at 231 deg C. In conjunction with ultrasonic soldering, it can be used to join difficult-to-wet materials like aluminum, titanium, glass, ceramics, and dissimilar materials. Potential applications include tubing, electronics, medical products, and structural components. In various base-metal (copper, aluminum, titanium) combinations, shear strength of about 5 ksi has been obtained. Currently available in ingot form, the solder will be available in a wire form at a later date.

EWI is a leading engineering and technology organization dedicated to materials joining and allied technologies. We provide applied research, manufacturing support, and strategic services to nearly 2,800 member company locations of global leaders in the aerospace, automotive, defense, energy and chemical industries.

Since 1996, S-Bond Technologies has solved difficult joining problems with its unique soldering-brazing and related bonding products and services. S-Bond Technologies offers a wide range of bonding and related services including: active solder joining, employing patented and licensed active solder joining processes and materials, conventional solder assembly, brazing, ultrasonic bonding, bonded carbide wear claddings and bond inspection services.

The business is focused on metal bonding, ceramic-metal bonding, and ceramic bonding, providing reliable high strength and/or hermetic bonds between metals, ceramics, piezo-electric ceramics, silicon, and other semiconductors, glasses, and carbon materials such as diamond and graphite. S-Bond technologies provides bonded assembly solutions including R&D, engineering, prototypes, and full production.

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www.ewi.org

www.s-bond.com