Home / SUB-MICRON TOLERANCES AND SURFACE FINISHES LESS THAN 1 RA

SUB-MICRON TOLERANCES AND SURFACE FINISHES LESS THAN 1 RA

Molecular Decomposition Process grinding technology developed by Oberg Industries uses an electrochemical action and an abrasive wheel to grind critical surface finishes on surgical needles, sharps and razor blades, and more.

Posted: July 30, 2010

Oberg Industries (Freeport, PA) offers advanced grinding technology with Molecular Decomposition Process (MDP). Developed for the most efficient removal or cutting of any conductive material, MDP uses an electrochemical action and an abrasive wheel to achieve surface finish of less than 1 RA and precision tolerances held to 0.0002 in – all without generating heat. The process is ideal for use with consumer or industrial products where surface finish and dimensional stability are imperative such as grinding surgical needles, sharps and razor blades.

The Molecular Decomposition Process is also suitable for applications requiring a surface free of micro cracks and fissures or other highly polished, weight-bearing and articulating surfaces. Gentle enough to grind thin-walled components without damage or distortion, MDP works well with tubing, rapid cut-off needs and grinding of complex features in exotic metals, including nitinol.

"No other method of grinding or cutting can compare in performance with speed, precision, repeatable accuracy and clean operation," said Joe DeAngelo, Director of Technical Development, Oberg Industries. "MDP can even eliminate secondary operations such as electro polishing, micro blasting and deburring without generating thermals or causing internal stress and distortion in the material. Its applications are endless."

During Molecular Decomposition Process, an electric current flows between the negatively charged abrasive wheel and the positively charged work piece through an environmentally friendly electrolyte (saline) solution. A decomposing action occurs causing the material surface to oxidize. This oxidized surface is then removed by the specially formulated abrasives in the wheel exposing more material and repeating the cycle.

MDP cuts conductive materials 80 percent faster than conventional methods and is especially effective on super-alloys and exotic metals. It can be used with the following conductive materials:
? Aluminum
? Beryllium
? Cobalt chrome
? Copper
? Inconel
? Iridium
? Molybdenum
? Nickel
? Nitinol
? Platinum
? Rhenium
? Single crystal alloys
? Stainless steel
? Titanium
? Titanium carbide
? Tungsten carbide
? Zirconium
? Other conductive ceramics and plastics

After working closely with Compositron Corporation, based in Brooklyn, NY, for over five years to further develop and refine the Molecular Decomposition Process, Oberg acquired the MDP technology and the full consumable products line of Voltron grinding wheels and electrolyte in July 2007. Voltron grinding wheels and electrolytic solution continue to be manufactured and developed at Oberg's Sarver, PA, campus to fit a variety of cutting and grinding applications.

——————————————————————

www.oberg.com

Subscribe to learn the latest in manufacturing.

Calendar & Events
Southeast Design – 2-Part Show
September 11 - 12, 2013
Greenville, SC
Mid-Atlantic Design – 2-Part Show
September 25 - 26, 2013
Phoenixville, PA
CMTS of Canada
September 30 - October 3, 2013
Mississauga, Canada
DISCOVER 2013
October 8 - 16, 2013
Florence, KY
Wisconsin Manufacturing and Technology Show
October 8 - 10, 2013
Wisconsin State Fair Park Exposition Center Halls B&C
WESTEC 2013
October 15 - 17, 2013
Los Angeles, CA
SOUTH-TEC
October 29 - 31, 2013
Greenville, SC
New England Design-2-Part Show
October 30 - 31, 2013
Marlborough, MA
DMG / Mori Seiki Manufacturing Days
November 12 - 15, 2013
Mori Seiki Manufacturing – Davis, CA
FABTECH
November 18 - 21, 2013
McCormick Place – Chicago, IL
Midwest Design-2-Part Show
November 20 - 21, 2013
Northern Kentucky Convention Center – Covington, KY
PCD Tool Manufacturing
November 20, 2013
United Grinding North America – Fredricksburg, VA